設備


UHV-sputtering system
(Three chambers
and 19 cathodes)
UHV-sputtering system
(8 cathodes)
UHV-sputtering system
(3 cathodes)
UHV-PVD system
(3 cathodes
and 1 EB gun)
UHV-PVD system
(3 cathodes and 2 organic cells)
 
Furnace
(Max. 1250C)
熱処理炉
東栄
熱処理炉
テック

 

 

           Characterizations (AIMR ANNEX & Integration lab. Bldg.)


   Dektak

X-ray diffractometer
for thin film (Common equipment)

     AFM
  
  VSM (RT, 2T)

CIPT(i-plane field)

 Polar micro-MOKE
  (RT, 2.5 T)

   Wire Bonding
Magneto-trasnport measurement
(5-300K, 2 T)

PPMS
DC&RF probing system
(RT, out-of-plane, 2.7T)
(RT, in-plane, 0.3T)
VNA ferromagnetic resonance(2-20 GHz) Time-resolved MOKE (TRMOKE) system
with Femtosecond Laser
(RT, 2.0T)

THz emmisio n 2 T in-plane field
Space-time resolved TRMOE microscopy trmoke 2T variable field
Mask alignner Ion beam etching Sputtering system
  EB lithography
(Common equipment)
FE-SEM
(Common equipment)